View CY7C1345B-117AC_656057.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

CY7C1345B
128K x 36 Synchronous Flow-Through 3.3V Cache RAM
Features
* Supports 117-MHz microprocessor cache systems with zero wait states * 128K by 36 common I/O * Fast clock-to-output times -- 7.5 ns (117-MHz version) * Two-bit wrap-around counter supporting either interleaved or linear burst sequence * Separate processor and controller address strobes provide direct interface with the processor and external cache controller * Synchronous self-timed write * Asynchronous output enable * Supports 3.3V & 2.5V I/O levels * ZZ "sleep" mode
Functional Description
The CY7C1345B is a 3.3V, 128K by 36 synchronous cache RAM designed to interface with high-speed microprocessors with minimum glue logic. Maximum access delay from clock rise is 7.5 ns (117-MHz version). A 2-bit on-chip counter captures the first address in a burst and increments the address automatically for the rest of the burst access. The CY7C1345B allows either interleaved or linear burst sequences, selected by the MODE input pin. A HIGH selects an interleaved burst sequence, while a LOW selects a linear burst sequence. Burst accesses can be initiated with the Processor Address Strobe (ADSP) or the cache Controller Address Strobe (ADSC) inputs. Address advancement is controlled by the Address Advancement (ADV) input. A synchronous self-timed write mechanism is provided to simplify the write interface. A synchronous chip enable input and an asynchronous output enable input provide easy control for bank selection and output three-state control.
Logic Block Diagram
CLK ADV ADSC ADSP A[16:0] GW BWE BWS3 BWS 2 BWS 1 BWS 0 CE1 CE2 CE3
MODE (A0,A1) 2 BURST Q0 CE COUNTER Q1 CLR Q ADDRESS CE REGISTER D DDQ[31:24],DP3Q BYTEWRITE REGISTERS DDQ[23:16],DP2Q BYTEWRITE REGISTERS D DQ[15:8],DP1 Q BYTEWRITE REGISTERS D DQ[7:0],DP0 Q BYTEWRITE REGISTERS D ENABLE Q CE REGISTER CLK INPUT REGISTERS CLK 15 17
17
15
128K X 36 MEMORY ARRAY
36
36
OE ZZ SLEEP CONTROL DQ[31:0] DP[3:0]
Selection Guide
7C1345B-117 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum Standby Current (mA)
Intel and Pentium are registered trademarks of Intel Corporation.
7C1345B-100 8.0 325 2.0
7.5 350 2.0
Cypress Semiconductor Corporation
*
3901 North First Street
*
San Jose
*
CA 95134
* 408-943-2600 September 11, 2000
CY7C1345B
Pin Configurations
100-Pin TQFP
OE ADSC BWS3 BWS2 BWS1 BWS0 CE1 CE2 CE3 VDD VSS ADSP ADV 84 83 BWE CLK GW A6 A7 A8 82 A9 81
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
DP2 DQ16 DQ17 VDDQ VSSQ DQ18 DQ19 BYTE2 DQ20 DQ21 VSSQ VDDQ DQ22 DQ23 NC VDD NC VSS DQ24 DQ25 VDDQ VSSQ DQ26 DQ27 DQ28 DQ29 VSSQ VDDQ DQ30 DQ31 DP3
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49
85
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50
DP1 DQ15 DQ14 VDDQ VSSQ DQ13 DQ12 DQ11 DQ10 VSSQ VDDQ DQ9 DQ8 VSS NC VDD ZZ DQ7 DQ6 VDDQ VSSQ DQ5 DQ4 DQ3 DQ2 VSSQ VDDQ DQ1 DQ0 DP0 BYTE1
CY7C1345B
BYTE3
BYTE0
MODE A5
DNU DNU A10 A11
DNU DNU
VDD
A4
A3
A2
A1
A0
A12
A13
A14 A15
VSS
2
A16
CY7C1345B
Pin Configurations (continued)
119-Ball BGA 1 A B C D E F G H J K L M N P R T U VDDQ NC NC DQc DQc VDDQ DQc DQc VDDQ DQd DQd VDDQ DQd DQd NC NC VDDQ 2 A CE2 A DQPc DQc DQc DQc DQc VDD DQd DQd DQd DQd DQPd A NC NC 3 A A A VSS VSS VSS BWc VSS NC VSS BWd VSS VSS VSS MODE A NC 4 ADSP ADSC VDD NC CE1 OE ADV GW VDD CLK NC BWE A1 A0 VDD A NC 5 A A A VSS VSS VSS BWb VSS NC VSS BWa VSS VSS VSS VSS A NC 6 A CE3 A DQPb DQb DQb DQb DQb VDD DQa DQa DQa DQa DQPa A NC NC 7 VDDQ NC NC DQb DQb VDDQ DQb DQb VDDQ DQa DQa VDDQ DQa DQa NC ZZ VDDQ
Pin Descriptions
Name ADSC I/O InputSynchronous InputSynchronous InputSynchronous InputSynchronous InputSynchronous InputSynchronous InputSynchronous InputSynchronous Input-Clock InputSynchronous InputSynchronous Description Address Strobe from Controller, sampled on the rising edge of CLK. When asserted LOW, A[15:0] is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. Address Strobe from Processor, sampled on the rising edge of CLK. When asserted LOW, A[15:0] is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is deasserted HIGH. A1, A 0 Address Inputs. These inputs feed the on-chip burst counter as the LSBs as well as being used to access a particular memory location in the memory array. Address Inputs used in conjunction with A[1:0] to select one of the 64K address locations. Sampled at the rising edge of the CLK, if CE1, CE2, and CE3 are sampled active, and ADSP or ADSC is active LOW. Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes. Sampled on the rising edge. BW0 controls DQ[7:0] and DP0, BW1 controls DQ [15:8] and DP1, BW2 controls DQ[23:16] and DP2, and BW3 controls DQ[31:24] and DP3. See Write Cycle Description table for further details. Advance Input, used to advance the on-chip address counter. When LOW the internal burst counter is advanced in a burst sequence. The burst sequence is selected using the MODE input. Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted LOW to conduct a byte write. Global Write Input, active LOW. Sampled on the rising edge of CLK. This signal is used to conduct a global write, independent of the state of BWE and BW[3:0]. Global writes override byte writes. Clock Input. Used to capture all synchronous inputs to the device. Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2 and CE3 to select/deselect the device. CE1 gates ADSP. Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1 and CE3 to select/deselect the device.
ADSP
A[1:0] A[16:2]
BW[3:0]
ADV BWE GW CLK CE1 CE2
3
CY7C1345B
Pin Descriptions (continued)
Name CE3 OE I/O InputSynchronous InputAsynchronous InputAsynchronous Description Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1 and CE2 to select/deselect the device. Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins. Snooze Input. Active HIGH asynchronous. When HIGH, the device enters a low-power standby mode in which all other inputs are ignored, but the data in the memory array is maintained.Leaving ZZ floating or NC will default the device into an active state. ZZ pin has an internal pull-down. Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst order. Pulled LOW selects the linear burst order. When left floating or NC, defaults to interleaved burst order. Mode pin has an internal pull-up. Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by A[16:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by OE in conjunction with the internal control logic. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ[31:0] and DP[3:0] are placed in a three-state condition. The outputs are automatically three-stated when a Write cycle is detected. Power supply inputs to the core of the device. Should be connected to 3.3V power supply. Ground for the I/O circuitry of the device. Should be connected to ground of the system. Ground for the device. Should be connected to ground of the system. Power supply for the I/O circuitry. Should be connected to a 3.3V power supply. No connects. Do not use pins. Should be left unconnected or tied LOW. serted active, and (2) ADSP or ADSC is asserted LOW (if the access is initiated by ADSC, the write inputs must be deasserted during this first cycle). The address presented to the address inputs is latched into the address register and the burst counter/control logic and presented to the memory core. If the OE input is asserted LOW, the requested data will be available at the data outputs a maximum to tCDV after clock rise. ADSP is ignored if CE1 is HIGH.
ZZ
MODE
DQ[31:0], DP[3:0]
I/OSynchronous
VDD VSS VSSQ VDDQ NC DNU
Power Supply Ground Ground I/O Power Supply -
Functional Overview
All synchronous inputs pass through input registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (t CDV) is 7.5 ns (117-MHz device). The CY7C1345B supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium and i486 processors. The linear burst sequence is suited for processors that utilize a linear burst sequence. The burst order is user selectable, and is determined by sampling the MODE input. Accesses can be initiated with either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC). Address advancement through the burst sequence is controlled by the ADV input. A two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. Byte write operations are qualified with the Byte Write Enable (BWE) and Byte Write Select (BW[3:0]) inputs. A Global Write Enable (GW) overrides all byte write inputs and writes data to all four bytes. All writes are simplified with on-chip synchronous self-timed write circuitry. Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output three-state control. ADSP is ignored if CE1 is HIGH. Single Read Accesses A single read access is initiated when the following conditions are satisfied at clock rise: (1) CE1, CE2, and CE3 are all as-
Functional Description
Single Write Accesses Initiated by ADSP This access is initiated when the following conditions are satisfied at clock rise: (1) CE1, CE2, and CE3 are all asserted active, and (2) ADSP is asserted LOW. The addresses presented are loaded into the address register and the burst counter/control logic and delivered to the RAM core. The write inputs (GW, BWE, and BW[3:0]) are ignored during this first clock cycle. If the write inputs are asserted active (see Write Cycle Descriptions table for appropriate states that indicate a write) on the next clock rise, the appropriate data will be latched and written into the device. Byte writes are allowed. During byte writes, BW0 controls DQ[7:0], BW1 controls DQ [15:8], BW2 controls DQ[23:16], and BW3 controls DQ[31:24]. All I/Os are three-stated during a byte write. Since this is a common I/O device, the asynchronous OE input signal must be deasserted and the I/Os must be three-stated prior to the presentation of data to DQ[31:0]. As a safety precaution, the data lines are three-stated once a write cycle is detected, regardless of the state of OE.
4
CY7C1345B
Single Write Accesses Initiated by ADSC This write access is initiated when the following conditions are satisfied at clock rise: (1) CE1, CE2, and CE3 are all asserted active, (2) ADSC is asserted LOW, (3) ADSP is deasserted HIGH, and (4) the write input signals (GW, BWE, and BW[3:0]) indicate a write access. ADSC is ignored if ADSP is active LOW. The addresses presented are loaded into the address register and the burst counter/control logic and delivered to the RAM core. The information presented to DQ[31:0] will be written into the specified address location. Byte writes are allowed. During byte writes, BW0 controls DQ [7:0], BW1 controls DQ [15:8], BW2 controls DQ[23:16], and BWS3 controls DQ [31:24]. All I/Os are three-stated when a write is detected, even a byte write. Since this is a common I/O device, the asynchronous OE input signal must be deasserted and the I/Os must be three-stated prior to the presentation of data to DQ[31:0]. As a safety precaution, the data lines are three-stated once a write cycle is detected, regardless of the state of OE. Table 1. Counter Implementation for the Intel(R) Pentium(R)/80486 Processor's Sequence First Address AX + 1, Ax 00 01 10 11 Second Address AX + 1, Ax 01 00 11 10 Third Address AX + 1, Ax 10 11 00 01 Fourth Address AX + 1, Ax 11 10 01 00
Table 2. Counter Implementation for a Linear Sequence First Address AX + 1, Ax 00 01 10 11 Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ HIGH places the SRAM in a power conservation "sleep" mode. Two clock cycles are required to enter into or exit from this "sleep" mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the "sleep" mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the "sleep" mode. CE1, CE2, CE3, ADSP and ADSC must remain , inactive for the duration of tZZREC after the ZZ input returns LOW. Leaving ZZ unconnected defaults the device into an active state. Second Address AX + 1, Ax 01 10 11 00 Third Address AX + 1, Ax 10 11 00 01 Fourth Address AX + 1, Ax 11 00 01 10
Burst Sequences
The CY7C1345B provides an on-chip 2-bit wraparound burst counter inside the SRAM. The burst counter is fed by A[1:0], and can follow either a linear or interleaved burst order. The burst order is determined by the state of the MODE input. A LOW on MODE will select a linear burst sequence. A HIGH on MODE will select an interleaved burst order. Leaving MODE unconnected will cause the device to default to a interleaved burst sequence.
5
CY7C1345B
Cycle Description Table[1, 2, 3]
Cycle Description Deselected Cycle, Power-down Deselected Cycle, Power-down Deselected Cycle, Power-down Deselected Cycle, Power-down Deselected Cycle, Power-down Snooze Mode, Power-down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst ADD Used None None None None None None External External External External External Next Next Next Next Next Next Current Current Current Current Current Current CE1 H L L L X X L L L L L X X H H X H X X H H X H CE3 X X H X X X L L L L L X X X X X X X X X X X X CE2 X L X L X X H H H H H X X X X X X X X X X X X ZZ L L L L L H L L L L L L L L L L L L L L L L L ADSP X L L H H X L L H H H H H X X H X H H X X H X ADSC L X X L L X X X L L L H H H H H H H H H H H H ADV X X X X X X X X X X X L L L L L L H H H H H H WE X X X X X X X X L H H H H H H L L H H H H L L OE X X X X X X L H X L H L H L H X X L H L H X X CLK L-H L-H L-H L-H L-H X L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H DQ High-Z High-Z High-Z High-Z High-Z High-Z Q High-Z D Q High-Z Q High-Z Q High-Z D D Q High-Z Q High-Z D D
Notes: 1. X = "Don't Care," 1 = Logic HIGH, 0 = Logic LOW. 2. The SRAM always initiates a read cycle when ADSP asserted, regardless of the state of GW, BWE, or BWS[3:0]. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to three-state. OE is a "Don't Care" for the remainder of the write cycle. 3. OE is asynchronous and is not sampled with the clock rise. During a read cycle DQ=High-Z when OE is inactive, and DQ=data when OE is active.
6
CY7C1345B
Write Cycle Descriptions[1, 2, 3, 4]
Function Read Read Write Byte 0, DP0 Write Byte 1, DP1 Write Bytes 1, 0, DP0, DP1 Write Byte 2, DP2 Write Bytes 2, 0, DP2, DP0 Write Bytes 2, 1, DP2, DP1 Write Bytes 2, 1, 0, DP2, DP1, DP0 Write Byte 3, DP3 Write Bytes 3, 0, DP3, DP0 Write Bytes 3, 1, DP3, DP0 Write Bytes 3, 1, 0, DP3, DP1, DP0 Write Bytes 3, 2, DP3, DP2 Write Bytes 3, 2, 0, DP3, DP2, DP0 Write Bytes 3, 2, 1, DP3, DP2, DP1 Write All Bytes Write All Bytes GW 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 BWE 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 X BW3 X 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 X BW2 X 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 X BW1 X 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 X BW0 X 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 X
ZZ Mode Electrical Characteristics
Parameter ICCZZ tZZS tZZREC Description Snooze mode standby current Device operation to ZZ ZZ recovery time Test Conditions ZZ > VDD - 0.2V ZZ > VDD - 0.2V ZZ < 0.2V 2tCYC Min. Max. 10 2tCYC mA ns ns Unit
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. -65C to +150C Ambient Temperature with Power Applied ............................................. -55C to +125C Supply Voltage on VDD Relative to GND........ -0.5V to +4.6V DC Voltage Applied to Outputs in High Z State[5] ....................................-0.5V to VDD + 0.5V DC Input Voltage[5].................................-0.5V to VDD + 0.5V
Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage .......................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current .................................................... >200 mA
Operating Range
Ambient Range Temperature[6] Com'l Ind'l 0C to +70C -40C to +85C VDD 3.135V to 3.6V VDDQ 2.375V to VDD
Notes: 4. When a write cycle is detected, all I/Os are three-stated, even during byte writes. 5. Minimum voltage equals -2.0V for pulse durations of less than 20 ns. 6. TA is the case temperature.
7
CY7C1345B
Electrical Characteristics Over the Operating Range
Parameter VOH VOL VIH VIH VIL VIL IX Description Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input HIGH Voltage Input LOW Voltage[5] Input LOW Voltage
[5]
Test Conditions VDDQ = 3.3V VDD = Min., IOH = -4.0 mA , VDDQ = 2.5V VDD = Min., IOH = -2.0 mA , VDDQ = 3.3V VDD = Min., IOL = 8.0 mA , VDDQ = 2.5V VDD = Min., IOL = 2.0 mA , VDDQ = 3.3V VDDQ = 2.5V VDDQ = 3.3V VDDQ = 2.5V GND VI VDDQ Input = VSS Input = VDDQ Input = VSS Input = VDDQ GND VI VDD, Output Disabled VDD = Max., VOUT = GND VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC Max. VDD, Device Deselected, VIN VIH or VIN VIL f = fMAX = 1/tCYC, inputs switching 8.5-ns cycle, 117 MHz 10-ns cycle, 100 MHz 8.5-ns cycle, 117 MHz 10-ns cycle, 100 MHz
Min. 2.4 2.0
Max.
Unit V V
0.4 0.7 2.0 1.7 -0.3 -0.3 -1 -30 5 -5 30 -5 5 -300 350 325 125 110 10 VDD + 0.3V VDD + 0.3V 0.8 0.7 1
V V V V V V A A A A A A mA mA mA mA mA mA
Input Load Current (except ZZ and MODE) Input Current of MODE Input Current of ZZ
IOZ IOS IDD ISB1
Output Leakage Current Output Short Circuit Current VDD Operating Supply Current Automatic CE Power-Down Current--TTL Inputs
[7]
ISB2
Automatic CE Power-Down Current--CMOS Inputs Automatic CE Power-Down Current--CMOS Inputs Automatic CE Power-Down Current--TTL Inputs
Max. VDD, Device Deselected, All speeds VIN 0.3V or VIN > VDDQ - 0.3V, f = 0, inputs static 8.5-ns cycle, 117 MHz Max. VDD, Device Deselected, VIN VDDQ- 0.3V or VIN 0.3V, 10-ns cycle, 100 MHz f = fMAX, inputs switching Max. VDD, Device Deselected, VIN VDD -0.3V or VIN 0.3V, f = 0, inputs static
ISB3
95 85 30
mA mA mA
ISB4
Note: 7. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
8
CY7C1345B
Capacitance[8]
Parameter CIN CI/O Description Input Capacitance I/O Capacitance Test Conditions TA = 25C, f = 1 MHz, VDD = 5.0V Max. 4.0 4.0 Unit pF pF
AC Test Loads and Waveforms
OUTPUT Z0 =50 RL =50 VL =1.5V R1=317 3.3V OUTPUT 5 pF INCLUDING JIG AND SCOPE 3.0V R2=351 GND 10% ALL INPUT PULSES 90% 90% 10%
Rise Time: 1 V/ns
Fall Time: 1 V/ns
(a)
(b)
Switching Characteristics Over the Operating Range[9]
-117 Parameter tCYC tCH tCL tAS tAH tCDV tDOH tADS tADH tWES tWEH tADVS tADVH tDS tDH tCES tCEH tCHZ tCLZ tEOHZ tEOLZ tEOV Clock Cycle Time Clock HIGH Clock LOW Address Set-Up Before CLK Rise Address Hold After CLK Rise Data Output Valid After CLK Rise Data Output Hold After CLK Rise ADSP ADSC Set-Up Before CLK Rise , ADSP ADSC Hold After CLK Rise , BWS[1:0], GW,BWE Set-Up Before CLK Rise BWS[1:0], GW,BWE Hold After CLK Rise ADV Set-Up Before CLK Rise ADV Hold After CLK Rise Data Input Set-Up Before CLK Rise Data Input Hold After CLK Rise Chip Enable Set-Up Chip Enable Hold After CLK Rise Clock to High-Z
[10, 11]
-100 Max. Min. 10 4.0 4.0 2.0 0.5 7.5 8.0 2.0 2.0 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 0.5 3.5 3.5 0 3.5 3.5 0 3.5 3.5 Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Description
Min. 8.5 3.0 3.0 2.0 0.5 2.0 2.0 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 0.5 0
Clock to Low-Z[10, 11] OE HIGH to Output High-Z[10, 12] OE LOW to Output Low-Z OE LOW to Output Valid
[10, 12]
0
Notes: 8. Tested initially and after any design or process changes that may affect these parameters. 9. Unless otherwise noted, test conditions assume signal transition time of 2.5 ns or less, timing reference levels of 1.25V, input pulse levels of 0 to 2.5V, and output loading of the specified IOL/IOH and load capacitance. Shown in (a) and (b) of AC Test Loads. 10. tCHZ, t CLZ, tEOHZ, and tEOLZ are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured 200 mV from steady-state voltage. 11. At any given voltage and temperature, tCHZ (max.) is less than tCLZ (min.). 12. This parameter is sampled and not 100% tested.
9
CY7C1345B
Timing Diagrams
Write Cycle Timing[13, 14]
S ingle W rite tCH tCYC
B urst W rite
Pipelined Write Unselected
CLK
tADH tADS tCL ADSP ignored with CE1 inactive
ADSP
tADS tADH
ADSC initiated write
ADSC
tADVS tADVH
ADV
tAS
ADV Must Be Inactive for ADSP Write
WD1 tAH WD2 WD3
ADD
GW
tWS tWH tWS CE1 masks ADSP tWH
WE
tCES tCEH
CE1
tCES tCEH Unselected with CE2
CE2
CE3
tCES tCEH
OE
tDS
tDH High-Z
Data In
High-Z
1a 1a
2a = UNDEFINED
2b
2c
2d
3a
= DON'T CARE
Notes: 13. WE is the combination of BWE, BW[3:0], and GW to define a write cycle (see Write Cycle Descriptions table). 14. WDx stands for Write Data to Address X.
10
CY7C1345B
Timing Diagrams (continued)
Read Cycle Timing[13, 15]
Single Read tCYC
Burst Read tCH Unselected Pipelined Read
CLK
tADS tADH tCL ADSP ignored with CE1 inactive
ADSP
tADS ADSC initiated read
ADSC
tADVS tADH tADVH RD1 tAH RD2 RD3 Suspend Burst
ADV
tAS
ADD
GW
tWS
tWH
tWS
WE
tCES tCEH tWH CE1 masks ADSP
CE1
Unselected with CE2
CE2
tCES tCEH
CE3
tCES tCEH tEOV tCDV tOEHZ 2a tCLZ tCHZ = DON'T CARE = UNDEFINED
OE
tDOH 2b 2c 2c 2d 3a
Data Out
1a 1a
Note: 15. RDx stands for Read Data from Address X.
11
CY7C1345B
Timing Diagrams (continued)
Read/Write Timing tCH tCYC tCL
CLK
tAH
B C D
tAS
ADD
A
tADS
tADH
ADSP
tADS tADH
ADSC
tADVS tADVH
ADV
tCES tCEH
CE1
tCES tCEH
CE
tWES tWEH
WE
ADSP ignored with CE1 HIGH tEOHZ
Q(A) Q(B) Q (B+1) Q (B+2) Q (B+3) Q(B) D(C) D (C+1) D (C+2) D (C+3) Q(D)
OE
tCLZ
Data In/Out
tCDV
tDOH tCHZ
Device originally deselected
WE is the combination of BWE, BWS[1:0], and GW to define a write cycle (see Write Cycle Descriptions table). CE is the combination of CE 2 and CE3. All chip selects need to be active in order to select the device. RAx stands for Read Address X, WAx stands for Write Address X, Dx stands for Data-in X, Qx stands for Data-out X. = DON'T CARE = UNDEFINED
12
CY7C1345B
Timing Diagrams (continued)
Pipeline Timing tCH tCYC tCL
CLK
tAS
ADD
RD1
RD2
RD3
RD4
WD1
WD2
WD3
WD4
tADS
ADSC initiated Reads
tADH
ADSC
ADSP initiated Reads
ADSP
ADV
tCES tCEH
CE1
CE
tWES tWEH
WE
ADSP ignored with CE1 HIGH
OE
tCLZ
Data In/Out
tCDV
1a Out
2a Out
3a Out
4a Out
1a In
2a In tDOH
3a In
4a D(C) In
Back to Back Reads
tCHZ Back to Back Writes
= DON'T CARE
= UNDEFINED
13
CY7C1345B
Timing Diagrams (continued)
OE Switching Waveforms
OE
tEOHZ tEOV
I/Os
three-state
tEOLZ
14
CY7C1345B
Timing Diagrams (continued)
ZZ Mode Timing [16, 17]
CLK
ADSP
HIGH
ADSC CE1
LOW
CE2
HIGH
CE3
ZZ
tZZS
ICC
ICC(active) ICCZZ
tZZREC
I/Os Three-state
Notes: 16. Device must be deselected when entering ZZ mode. See Cycle Description Table for all possible signal conditions to deselect the device. 17. I/Os are in three-state when exiting ZZ sleep mode.
15
CY7C1345B
Ordering Information
Speed (MHz) 117 100 Ordering Code CY7C1345B-117AC CY7C1345B-117BGC CY7C1345B-100AC CY7C1345B-100BGC CY7C1345B-100AI CY7C1345B-100BGI Document #: 38-00953-*B Package Name A101 BG119 A101 BG119 A101 BG119 119-Ball BGA 100-Lead Thin Quad Flat Pack 119-Ball BGA 100-Lead Thin Quad Flat Pack 119-Ball BGA Industrial Package Type 100-Lead Thin Quad Flat Pack Operating Range Commercial
Package Diagram
100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
51-85050-A
16
CY7C1345B
Package Diagram
119-Lead FBGA (14 x 22 x 2.4 mm) BG119
51-85115
(c) Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.

▲Up To Search▲

Price & Availability of CY7C1345B-117AC

	To Download CY7C1345B-117AC Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .